- UID
- 606455
- 在线时间
- 小时
- 注册时间
- 2011-2-17
- 最后登录
- 1970-1-1
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Round #2 Full scholarship package in MBA.
Background: Education- Bachelor of engineering in Beijing. Master of Science at UW. Working Experience- Two years professional R&D experiencein a Fortune #500 company. Successful SOP project leading experience in Asian market. Rich oversea training and workingexperience in both Asia and North America. GMAT: 700+ GPA: 3.8/4.0 "Many thanks to the current students at UW Madison offering me unique guidance during my application! I really appreciate your kindness! Go Badgers!" |
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