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[录取汇报] In @ University of Wisconsin- Madison

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楼主
发表于 2011-2-18 21:43:46 | 只看该作者 回帖奖励 |倒序浏览 |阅读模式
Round #2
Full scholarship package in MBA.

Background:
Education-
Bachelor of engineering in Beijing.
Master of Science at UW.
Working Experience-
Two years professional R&D experiencein a Fortune #500 company.
Successful SOP project leading experience in Asian market.
Rich oversea training and workingexperience in both Asia and North America.
GMAT: 700+
GPA: 3.8/4.0                                    
"Many thanks to the current students at UW Madison offering me  unique guidance during my application! I really appreciate your kindness! Go Badgers!"
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沙发
发表于 2011-2-18 22:59:36 | 只看该作者
Cong!!!!!
板凳
发表于 2011-2-18 22:59:59 | 只看该作者
今年貌似还没有出现fellowship,都是PA呀
地板
 楼主| 发表于 2011-2-19 00:38:19 | 只看该作者
Thank you Joe! Good luck to you and hope to see you in Fall.
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